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Solder Joint Reliability: Theory and Applications John H. Lau 1991 edition
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Solder Joint Reliability: Theory and Applications
John H. Lau
New electronic packaging centers stimulate applications, and materials engineering and science departments have demonstrated a new vigor to improve both the materials and our understanding of them.
631 pages, 146 black & white illustrations, biography
| Mediji | Grāmatas Hardcover Book (Grāmata ar cieto muguriņu un vāku) |
| Izlaists | 1991. gada 31. maijs |
| ISBN13 | 9780442002602 |
| Izdevēji | Van Nostrand Reinhold Inc.,U.S. |
| Lapas | 631 |
| Izmēri | 155 × 235 × 34 mm · 975 g |
| Valoda | Angļu |
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