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Fan-Out Wafer-Level Packaging John H. Lau 2018 edition
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Fan-Out Wafer-Level Packaging
John H. Lau
This comprehensive guide to fan-out wafer-level packaging (FOWLP) technology compares FOWLP with flip chip and fan-in wafer-level packaging.
303 pages, 150 Tables, color; 226 Illustrations, color; 52 Illustrations, black and white; XX, 303 p
| Mediji | Grāmatas Hardcover Book (Grāmata ar cieto muguriņu un vāku) |
| Izlaists | 2018. gada 13. aprīlis |
| ISBN13 | 9789811088834 |
| Izdevēji | Springer Verlag, Singapore |
| Lapas | 303 |
| Izmēri | 170 × 241 × 27 mm · 660 g |
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