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Chiplet Design and Heterogeneous Integration Packaging John H. Lau 2023 edition
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Chiplet Design and Heterogeneous Integration Packaging
John H. Lau
525 pages, 501 Illustrations, color; 42 Illustrations, black and white; XXII, 525 p. 543 illus., 501
| Mediji | Grāmatas Hardcover Book (Grāmata ar cieto muguriņu un vāku) |
| Izlaists | 2023. gada 28. marts |
| ISBN13 | 9789811999161 |
| Izdevēji | Springer Verlag, Singapore |
| Lapas | 525 |
| Izmēri | 242 × 162 × 33 mm · 1,07 kg |
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