Pastāsti draugiem par šo preci:
Solder Joint Reliability: Theory and Applications John H. Lau Softcover reprint of the original 1st ed. 1991 edition
Solder Joint Reliability: Theory and Applications
John H. Lau
New electronic packaging centers stimulate applications, and materials engineering and science departments have demonstrated a new vigor to improve both the materials and our understanding of them.
652 pages, 146 black & white illustrations, biography
| Mediji | Grāmatas Paperback Book (Grāmata ar mīksto vāku un līmēto muguru) |
| Izlaists | 2014. gada 23. februāris |
| ISBN13 | 9781461367437 |
| Izdevēji | Springer-Verlag New York Inc. |
| Lapas | 631 |
| Izmēri | 155 × 235 × 34 mm · 902 g |
| Valoda | Angļu |