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Semiconductor Advanced Packaging John H. Lau 2021 edition
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Semiconductor Advanced Packaging
John H. Lau
498 pages, 300 Tables, color; 530 Illustrations, color; 27 Illustrations, black and white; XXII, 498
| Mediji | Grāmatas Hardcover Book (Grāmata ar cieto muguriņu un vāku) |
| Izlaists | 2021. gada 18. maijs |
| ISBN13 | 9789811613753 |
| Izdevēji | Springer Verlag, Singapore |
| Lapas | 498 |
| Izmēri | 163 × 242 × 41 mm · 1,08 kg |
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