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Heterogeneous Integrations John H. Lau 2019 edition
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Heterogeneous Integrations
John H. Lau
This book addresses the fabrication of RDLs for heterogeneous integrations, and especially focuses on RDLs on: A) organic substrates, B) silicon substrates (through-silicon via (TSV)-interposers), C) silicon substrates (bridges), D) fan-out substrates, and E) ASIC, memory, LED, MEMS, and VCSEL systems.
368 pages, 300 Tables, color; 342 Illustrations, color; 44 Illustrations, black and white; XXII, 368
| Mediji | Grāmatas Hardcover Book (Grāmata ar cieto muguriņu un vāku) |
| Izlaists | 2019. gada 12. aprīlis |
| ISBN13 | 9789811372230 |
| Izdevēji | Springer Verlag, Singapore |
| Lapas | 368 |
| Izmēri | 150 × 220 × 20 mm · 752 g |
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