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Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology John H. Lau
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Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology
John H. Lau
501 pages, 520 Illustrations, color; 36 Illustrations, black and white; XX, 501 p. 556 illus., 520 i
| Mediji | Grāmatas Hardcover Book (Grāmata ar cieto muguriņu un vāku) |
| Izlaists | 2024. gada 24. maijs |
| ISBN13 | 9789819721399 |
| Izdevēji | Springer Verlag, Singapore |
| Lapas | 501 |
| Izmēri | 150 × 220 × 20 mm · 1,03 kg |
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![Cover for John H. Lau · Assembly and Reliability of Lead-Free Solder Joints (Hardcover Book) [2020 edition] (2020)](https://imusic.b-cdn.net/images/item/original/190/9789811539190.jpg?john-h-lau-2020-assembly-and-reliability-of-lead-free-solder-joints-hardcover-book&class=scaled&v=1588376991)
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![Cover for John H. Lau · Solder Joint Reliability: Theory and Applications (Hardcover Book) [1991 edition] (1991)](https://imusic.b-cdn.net/images/item/original/602/9780442002602.jpg?john-h-lau-1991-solder-joint-reliability-theory-and-applications-hardcover-book&class=scaled&v=1516985150)
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