Pastāsti draugiem par šo preci:
Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology John H. Lau
Cena
€ 168,49
Pasūtīts no attālās noliktavas
Paredzamā piegāde . gada 23. nov. - . gada 1. dec.
Ziemassvētku dāvanas var atgriezt līdz 31. janvārim
Saņemiet paziņojumus par jauniem John H. Lau izdevumiem
Mūsu klienti saka:
Pievienot savam iMusic vēlmju sarakstam
Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology
John H. Lau
501 pages, 520 Illustrations, color; 36 Illustrations, black and white; XX, 501 p. 556 illus., 520 i
| Mediji | Grāmatas Hardcover Book (Grāmata ar cieto muguriņu un vāku) |
| Izlaists | 2024. gada 24. maijs |
| ISBN13 | 9789819721399 |
| Izdevēji | Springer Verlag, Singapore |
| Lapas | 501 |
| Izmēri | 150 × 220 × 20 mm · 1,03 kg |
![Cover for John H. Lau · Chiplet Design and Heterogeneous Integration Packaging (Hardcover Book) [2023 edition] (2023)](https://imusic.b-cdn.net/images/item/original/161/9789811999161.jpg?john-h-lau-2023-chiplet-design-and-heterogeneous-integration-packaging-hardcover-book&class=scaled&v=1695532633)
![Cover for John H. Lau · Semiconductor Advanced Packaging (Hardcover Book) [2021 edition] (2021)](https://imusic.b-cdn.net/images/item/original/753/9789811613753.jpg?john-h-lau-2021-semiconductor-advanced-packaging-hardcover-book&class=scaled&v=1623687781)
![Cover for John H. Lau · Assembly and Reliability of Lead-Free Solder Joints (Hardcover Book) [2020 edition] (2020)](https://imusic.b-cdn.net/images/item/original/190/9789811539190.jpg?john-h-lau-2020-assembly-and-reliability-of-lead-free-solder-joints-hardcover-book&class=scaled&v=1588376991)
![Cover for John H. Lau · Heterogeneous Integrations (Hardcover Book) [2019 edition] (2019)](https://imusic.b-cdn.net/images/item/original/230/9789811372230.jpg?john-h-lau-2019-heterogeneous-integrations-hardcover-book&class=scaled&v=1588376885)
![Cover for John H. Lau · Fan-Out Wafer-Level Packaging (Hardcover Book) [2018 edition] (2018)](https://imusic.b-cdn.net/images/item/original/834/9789811088834.jpg?john-h-lau-2018-fan-out-wafer-level-packaging-hardcover-book&class=scaled&v=1588376972)
![Cover for John H. Lau · Handbook Of Tape Automated Bonding (Hardcover Book) [1992 edition] (1992)](https://imusic.b-cdn.net/images/item/original/279/9780442004279.jpg?john-h-lau-1992-handbook-of-tape-automated-bonding-hardcover-book&class=scaled&v=1570666783)
![Cover for John H. Lau · Solder Joint Reliability: Theory and Applications (Hardcover Book) [1991 edition] (1991)](https://imusic.b-cdn.net/images/item/original/602/9780442002602.jpg?john-h-lau-1991-solder-joint-reliability-theory-and-applications-hardcover-book&class=scaled&v=1516985150)
![Cover for Glycoconjugates of the Pancreas (Hardcover Book) [2024 edition] (2027)](https://imusic.b-cdn.net/images/item/original/669/9789819947669.jpg?2027-glycoconjugates-of-the-pancreas-hardcover-book&class=scaled&v=1774521203)
![Cover for Kate Shaw · The Squander and Salvage of Global Urban Waterfronts (Paperback Book) [1st ed. 2024 edition] (2027)](https://imusic.b-cdn.net/images/item/original/469/9789811369469.jpg?kate-shaw-2027-the-squander-and-salvage-of-global-urban-waterfronts-paperback-book&class=scaled&v=1570219621)
![Cover for The Korean Tidal Flats: Sediments and Organisms - Environmental Earth Sciences (Hardcover Book) [Second Edition 2027 edition] (2027)](https://imusic.b-cdn.net/images/item/original/012/9789819211012.jpg?2027-the-korean-tidal-flats-sediments-and-organisms-environmental-earth-sciences-hardcover-book&class=scaled&v=1790614039)
