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Lead Free Solder: Mechanics and Reliability John Hock Lye Pang 2012 edition
Lead Free Solder: Mechanics and Reliability
John Hock Lye Pang
Lead-free solders play a crucial role in the electronics industry. Featuring in-depth design and reliability information on lead-free deformation and failure analysis, this book covers a wide range of topics including advanced material mechanics theory.
175 pages, 21 black & white tables, biography
| Mediji | Grāmatas Hardcover Book (Grāmata ar cieto muguriņu un vāku) |
| Izlaists | 2011. gada 14. oktobris |
| ISBN13 | 9781461404620 |
| Izdevēji | Springer-Verlag New York Inc. |
| Žanrs | Aspects (Academic) > Science / Technology Aspects |
| Lapas | 175 |
| Izmēri | 155 × 235 × 12 mm · 439 g |
| Valoda | Angļu |