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Advanced MEMS Packaging John Lau Ed edition
Advanced MEMS Packaging
John Lau
This book presents the latest and cutting-edge MEMS (Microelectromechanical systems) packaging techniques such as low-temperature bonding and 3D packaging.
576 pages, Illustrations
| Mediji | Grāmatas Hardcover Book (Grāmata ar cieto muguriņu un vāku) |
| Izlaists | 2009. gada 16. decembris |
| ISBN13 | 9780071626231 |
| Izdevēji | McGraw-Hill Education - Europe |
| Lapas | 576 |
| Izmēri | 161 × 237 × 36 mm · 906 g |
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