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Through-Silicon Vias for 3D Integration John Lau Ed edition
Through-Silicon Vias for 3D Integration
John Lau
This professional book focuses on the latest cost- and space-saving methods of 3D integrated circuits—essential for the development of low-cost, high-performance electronic and optoelectronic products.
512 pages, ill
| Mediji | Grāmatas Hardcover Book (Grāmata ar cieto muguriņu un vāku) |
| Izlaists | 2012. gada 16. decembris |
| ISBN13 | 9780071785143 |
| Izdevēji | McGraw-Hill Education - Europe |
| Lapas | 512 |
| Izmēri | 160 × 231 × 21 mm · 722 g |
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