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Reliability of RoHS-Compliant 2D and 3D IC Interconnects John Lau Ed edition
Reliability of RoHS-Compliant 2D and 3D IC Interconnects
John Lau
Unique global coverage of RoHS-compliant materials for electronics manufacturing and for packaging assembly and semiconductor integration
640 pages, Illustrations
| Mediji | Grāmatas Hardcover Book (Grāmata ar cieto muguriņu un vāku) |
| Izlaists | 2010. gada 16. decembris |
| ISBN13 | 9780071753791 |
| Izdevēji | McGraw-Hill Education - Europe |
| Lapas | 640 |
| Izmēri | 152 × 236 × 34 mm · 910 g |