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Hybrid Bonding, Advanced Substrates, Failure Mechanisms, and Thermal Management for Chiplets and Heterogeneous Integration John Lau
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Hybrid Bonding, Advanced Substrates, Failure Mechanisms, and Thermal Management for Chiplets and Heterogeneous Integration
John Lau
This book is an essential resource for researchers, engineers, and students in electrical engineering, mechanical engineering, materials science, and industrial engineering, equipping them with the knowledge to advance innovation in semiconductor packaging and integration.
| Mediji | Grāmatas Hardcover Book (Grāmata ar cieto muguriņu un vāku) |
| Izlaists | 2025. gada 19. maijs |
| ISBN13 | 9789819641659 |
| Izdevēji | Springer Nature Switzerland AG |
| Lapas | 645 |
| Izmēri | 150 × 220 × 20 mm · 1,28 kg |
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