Pastāsti draugiem par šo preci:
Copper Electrodeposition for Nanofabrication of Electronics Devices - Nanostructure Science and Technology Softcover reprint of the original 1st ed. 2014 edition
Copper Electrodeposition for Nanofabrication of Electronics Devices - Nanostructure Science and Technology
In addition, the book will also cover important topics such as: * ULSI wiring material based upon copper nanowiring * Printed circuit boards * Stacked semiconductors * Through Silicon Via * Smooth copper foil for Lithium-Ion battery electrodes.
290 pages, 115 black & white illustrations, 75 colour illustrations, 12 black & white tables, biogra
| Mediji | Grāmatas Paperback Book (Grāmata ar mīksto vāku un līmēto muguru) |
| Izlaists | 2016. gada 23. augusts |
| ISBN13 | 9781493953738 |
| Izdevēji | Springer-Verlag New York Inc. |
| Lapas | 282 |
| Izmēri | 155 × 235 × 15 mm · 412 g |
| Valoda | Angļu |
| Redaktors | Akolkar, Rohan N. |
| Redaktors | Barkey, Dale P. |
| Redaktors | Kondo, Kazuo |
| Redaktors | Yokoi, Masayuki |