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Fundamentals of Lead-Free Solder Interconnect Technology: From Microstructures to Reliability Tae-Kyu Lee Softcover reprint of the original 1st ed. 2015 edition
Fundamentals of Lead-Free Solder Interconnect Technology: From Microstructures to Reliability
Tae-Kyu Lee
This unique book provides an up-to-date overview of the concepts behind lead-free soldering techniques. Readers will find a description of the physical and mechanical properties of lead-free solders, in addition to lead-free electronics and solder alloys.
266 pages, 70 black & white illustrations, 81 colour illustrations, 18 black & white tables, biograp
| Mediji | Grāmatas Paperback Book (Grāmata ar mīksto vāku un līmēto muguru) |
| Izlaists | 2016. gada 1. oktobris |
| ISBN13 | 9781489978011 |
| Izdevēji | Springer-Verlag New York Inc. |
| Lapas | 253 |
| Izmēri | 150 × 220 × 10 mm · 460 g |
| Valoda | Angļu |