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Fundamentals of Lead-Free Solder Interconnect Technology: From Microstructures to Reliability Tae-Kyu Lee 2015 edition
Fundamentals of Lead-Free Solder Interconnect Technology: From Microstructures to Reliability
Tae-Kyu Lee
This unique book provides an up-to-date overview of the concepts behind lead-free soldering techniques. Readers will find a description of the physical and mechanical properties of lead-free solders, in addition to lead-free electronics and solder alloys.
253 pages, 69 black & white illustrations, 81 colour illustrations, 18 black & white tables, biograp
| Mediji | Grāmatas Hardcover Book (Grāmata ar cieto muguriņu un vāku) |
| Izlaists | 2014. gada 6. novembris |
| ISBN13 | 9781461492658 |
| Izdevēji | Springer-Verlag New York Inc. |
| Lapas | 253 |
| Izmēri | 163 × 241 × 16 mm · 553 g |
| Valoda | Angļu |