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Failure Modes and Mechanisms in Electronic Packages P. Singh Softcover reprint of the original 1st ed. 1998 edition
Failure Modes and Mechanisms in Electronic Packages
P. Singh
With the proliferation of packaging technology, failure and reliability have become serious concerns. This invaluable reference details processes that enable detection, analysis and prevention of failures. It provides a comprehensive account of the failures of device packages, discrete component connectors, PCB carriers and PCB assemblies.
370 pages, biography
| Mediji | Grāmatas Paperback Book (Grāmata ar mīksto vāku un līmēto muguru) |
| Izlaists | 2012. gada 24. oktobris |
| ISBN13 | 9781461377634 |
| Izdevēji | Springer-Verlag New York Inc. |
| Lapas | 370 |
| Izmēri | 155 × 235 × 20 mm · 553 g |
| Valoda | Angļu |
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