Pastāsti draugiem par šo preci:
Failure Modes and Mechanisms in Electronic Packages P. Singh 1997 edition
Failure Modes and Mechanisms in Electronic Packages
P. Singh
With the proliferation of packaging technology, failure and reliability have become serious concerns. This invaluable reference details processes that enable detection, analysis and prevention of failures. It provides a comprehensive account of the failures of device packages, discrete component connectors, PCB carriers and PCB assemblies.
370 pages, biography
| Mediji | Grāmatas Hardcover Book (Grāmata ar cieto muguriņu un vāku) |
| Izlaists | 1997. gada 30. novembris |
| ISBN13 | 9780412105913 |
| Izdevēji | Chapman and Hall |
| Lapas | 370 |
| Izmēri | 155 × 235 × 22 mm · 698 g |
| Valoda | Angļu |