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Assembly and Reliability of Lead-Free Solder Joints John H. Lau 2020 edition
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Assembly and Reliability of Lead-Free Solder Joints
John H. Lau
527 pages, 250 Tables, color; 347 Illustrations, color; 251 Illustrations, black and white; XXI, 527
| Mediji | Grāmatas Paperback Book (Grāmata ar mīksto vāku un līmēto muguru) |
| Izlaists | 2021. gada 30. maijs |
| ISBN13 | 9789811539220 |
| Izdevēji | Springer Verlag, Singapore |
| Lapas | 527 |
| Izmēri | 156 × 233 × 28 mm · 908 g |
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