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Advanced Flip Chip Packaging Ho-ming Tong 2012 edition
Advanced Flip Chip Packaging
Ho-ming Tong
Advanced Flip Chip Packaging presents past, present and future advances and trends in areas such as substrate technology, material development, and assembly processes.
500 pages, 171 black & white illustrations, 242 colour illustrations, 37 black & white tables
| Mediji | Grāmatas Hardcover Book (Grāmata ar cieto muguriņu un vāku) |
| Izlaists | 2013. gada 21. marts |
| ISBN13 | 9781441957672 |
| Izdevēji | Springer-Verlag New York Inc. |
| Lapas | 560 |
| Izmēri | 162 × 243 × 26 mm · 922 g |
| Valoda | Angļu |
| Redaktors | Lai, Yi-Shao |
| Redaktors | Tong, Ho-Ming |
| Redaktors | Wong, C.P. |