Reliability of Microtechnology: Interconnects, Devices and Systems - Johan Liu - Grāmatas - Springer-Verlag New York Inc. - 9781441957597 - 2011. gada 14. februāris
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Johan Liu
Reliability of Microtechnology: Interconnects, Devices and Systems 2011 edition

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€ 181,49

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Reliability of Microtechnology discusses the reliability of microtechnology products from the bottom up, beginning with devices and extending to systems.

Marc Notes: Includes bibliographical references and index. Brief Description: This text discusses the reliability of microtechnology products from the bottom up, beginning with devices and extending to systems. It covers many topics, and it addresses specific failure modes in solder and conductive adhesives at great length. Table of Contents: Introduction to Reliability and its Importance.- Reliability Metrology.- General Failure Mechanisms of Microsystems.- Solder and Conductive Adhesive Joint Reliability.- Accelerated Testing.- Reliability Design for Manufacturability.- Component Reliability.- System Level Reliability.- Reliability and Quality Management of Microsystem.- Experimental Tools for Reliability Analysis. Jacket Description/Back: Reliability of Microtechnology discusses the reliability of microtechnology products from the bottom up, beginning with devices and extending to systems. The book's focus includes but is not limited to reliability issues of interconnects, the methodology of reliability concepts and general failure mechanisms. Specific failure modes in solder and conductive adhesives are discussed at great length. Coverage of accelerated testing, component and system level reliability, and reliability design for manufacturability are also described in detail. The book also: Discusses the general failure mechanisms of microsystems on a component levelOffers comprehensive coverage of solder joint reliability at the microsystems levelAnalyzes quality issues and manufacturing at the microsystems levelReliability of Microtechnology is an ideal volume for researchers and professional engineers working in reliability and manufacturing. The book also includes exercises and detailed solutions at the end of each chapter."

Mediji Grāmatas     Hardcover Book   (Grāmata ar cieto muguriņu un vāku)
Izlaists 2011. gada 14. februāris
Oriģinālā izdošanas datums 2010
ISBN13 9781441957597
Izdevēji Springer-Verlag New York Inc.
Žanrs Aspects (Academic) > Science / Technology Aspects
Lapas 204
Izmēri 160 × 238 × 19 mm   ·   485 g
Valoda Angļu  

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