Solder Joint Reliability Prediction for Multiple Environments - Andrew E. Perkins - Grāmatas - Springer-Verlag New York Inc. - 9781441946348 - 2010. gada 5. novembris
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Solder Joint Reliability Prediction for Multiple Environments Softcover reprint of hardcover 1st ed. 2009 edition

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Solder Joint Reliability Prediction for Multiple Environments will provide industry engineers, graduate students and academic researchers, and reliability experts with insights and useful tools for evaluating solder joint reliability of ceramic area array electronic packages under multiple environments.


192 pages, 70 black & white illustrations, 37 black & white tables, biography

Mediji Grāmatas     Paperback Book   (Grāmata ar mīksto vāku un līmēto muguru)
Izlaists 2010. gada 5. novembris
ISBN13 9781441946348
Izdevēji Springer-Verlag New York Inc.
Lapas 192
Izmēri 155 × 235 × 11 mm   ·   299 g
Valoda Angļu  

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