Pastāsti draugiem par šo preci:
Microelectronics Packaging Handbook: Technology Drivers Part I R.R. Tummala 2nd ed. 1997 edition
Microelectronics Packaging Handbook: Technology Drivers Part I
R.R. Tummala
Electronics has become the largest industry, surpassing agriCUlture, auto. the packaging of semiconductors for systems use in auto, telecom, computer, consumer, aerospace, and medical industries. It is a key enabling technology achieving the requirements for reducing the size and cost at the system and product level.
720 pages, biography
| Mediji | Grāmatas Hardcover Book (Grāmata ar cieto muguriņu un vāku) |
| Izlaists | 1997. gada 31. janvāris |
| ISBN13 | 9780412084317 |
| Izdevēji | Chapman and Hall |
| Lapas | 720 |
| Izmēri | 243 × 167 × 48 mm · 1,09 kg |
| Valoda | Angļu Franču |
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