Pastāsti draugiem par šo preci:
Solder Joint Technology: Materials, Properties, and Reliability - Springer Series in Materials Science King-Ning Tu 2007 edition
Solder Joint Technology: Materials, Properties, and Reliability - Springer Series in Materials Science
King-Ning Tu
The European Union's directive banning the use of lead-based (Pb) solders in electronic consumer products has created an urgent need for research on solder joint behavior under various driving forces in electronic manufacturing, and for development of lead-free solders.
370 pages, biography
| Mediji | Grāmatas Hardcover Book (Grāmata ar cieto muguriņu un vāku) |
| Izlaists | 2007. gada 22. augusts |
| ISBN13 | 9780387388908 |
| Izdevēji | Springer-Verlag New York Inc. |
| Lapas | 370 |
| Izmēri | 156 × 235 × 23 mm · 662 g |
| Valoda | Angļu |