Pastāsti draugiem par šo preci:
Solder Joint Technology: Materials, Properties, and Reliability - Springer Series in Materials Science King-Ning Tu Softcover reprint of hardcover 1st ed. 2007 edition
Solder Joint Technology: Materials, Properties, and Reliability - Springer Series in Materials Science
King-Ning Tu
The European Union's directive banning the use of lead-based (Pb) solders in electronic consumer products has created an urgent need for research on solder joint behavior under various driving forces in electronic manufacturing, and for development of lead-free solders.
370 pages, biography
| Mediji | Grāmatas Paperback Book (Grāmata ar mīksto vāku un līmēto muguru) |
| Izlaists | 2010. gada 19. novembris |
| ISBN13 | 9781441922847 |
| Izdevēji | Springer-Verlag New York Inc. |
| Lapas | 370 |
| Izmēri | 155 × 235 × 20 mm · 539 g |
| Valoda | Angļu |
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