Pastāsti draugiem par šo preci:
Integrated Circuit Packaging, Assembly and Interconnections William Greig 2007 edition
Integrated Circuit Packaging, Assembly and Interconnections
William Greig
Reviewing the various IC packaging, assembly, and interconnection technologies, this professional reference provides an overview of the materials and the processes, as well as the trends and available options that encompass electronic manufacturing.
300 pages, 75 black & white illustrations, biography
| Mediji | Grāmatas Hardcover Book (Grāmata ar cieto muguriņu un vāku) |
| Izlaists | 2007. gada 30. marts |
| ISBN13 | 9780387281537 |
| Izdevēji | Springer-Verlag New York Inc. |
| Lapas | 300 |
| Izmēri | 155 × 235 × 19 mm · 662 g |
| Valoda | Angļu |