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Semiconductor Advanced Packaging John H. Lau 2021 edition
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Semiconductor Advanced Packaging
John H. Lau
498 pages, 300 Tables, color; 530 Illustrations, color; 27 Illustrations, black and white; XXII, 498
| Mediji | Grāmatas Paperback Book (Grāmata ar mīksto vāku un līmēto muguru) |
| Izlaists | 2022. gada 19. maijs |
| ISBN13 | 9789811613784 |
| Izdevēji | Springer Verlag, Singapore |
| Lapas | 498 |
| Izmēri | 157 × 236 × 31 mm · 800 g |
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