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Wafer-Level Chip-Scale Packaging: Analog and Power Semiconductor Applications Shichun Qu 2015 edition
Wafer-Level Chip-Scale Packaging: Analog and Power Semiconductor Applications
Shichun Qu
Analog and Power Wafer Level Chip Scale Packaging presents a state-of-art and in-depth overview in analog and power WLCSP design, material characterization, reliability and modeling.
339 pages, 58 black & white illustrations, 256 colour illustrations, 58 black & white tables, biogra
| Mediji | Grāmatas Hardcover Book (Grāmata ar cieto muguriņu un vāku) |
| Izlaists | 2014. gada 11. septembris |
| ISBN13 | 9781493915552 |
| Izdevēji | Springer-Verlag New York Inc. |
| Lapas | 322 |
| Izmēri | 155 × 235 × 21 mm · 653 g |
| Valoda | Angļu |