Pastāsti draugiem par šo preci:
Advanced Materials for Thermal Management of Electronic Packaging - Springer Series in Advanced Microelectronics Tong, Xingcun Colin, Ph.D. 2011 edition
Advanced Materials for Thermal Management of Electronic Packaging - Springer Series in Advanced Microelectronics
Tong, Xingcun Colin, Ph.D.
The need for advanced thermal management materials in electronic packaging has been widely recognized as thermal challenges become barriers to the electronic industry's ability to provide continued improvements in device and system performance.
550 pages, 26 black & white tables, biography
| Mediji | Grāmatas Paperback Book (Grāmata ar mīksto vāku un līmēto muguru) |
| Izlaists | 2013. gada 25. februāris |
| ISBN13 | 9781461427926 |
| Izdevēji | Springer-Verlag New York Inc. |
| Lapas | 618 |
| Izmēri | 236 × 243 × 31 mm · 884 g |
| Valoda | Angļu |