Pastāsti draugiem par šo preci:
Reliability, Yield, and Stress Burn-in: a Unified Approach for Microelectronics Systems Manufacturing & Software Development Way Kuo Softcover Reprint of the Original 1st Ed. 1998 edition
Reliability, Yield, and Stress Burn-in: a Unified Approach for Microelectronics Systems Manufacturing & Software Development
Way Kuo
420 pages, biography
| Mediji | Grāmatas Paperback Book (Grāmata ar mīksto vāku un līmēto muguru) |
| Izlaists | 2014. gada 14. marts |
| ISBN13 | 9781461375968 |
| Izdevēji | Springer-Verlag New York Inc. |
| Lapas | 420 |
| Izmēri | 155 × 235 × 22 mm · 589 g |
| Valoda | Angļu |