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RF and Microwave Microelectronics Packaging Ken Kuang 2010 edition
RF and Microwave Microelectronics Packaging
Ken Kuang
RF and Microwave Microelectronics Packaging presents the latest developments in packaging for high-frequency electronics. It will appeal to practicing engineers in the electronic packaging and high-frequency electronics fields and to academic researchers interested in understanding leading issues in the commercial sector.
285 pages, 15 black & white tables, biography
| Mediji | Grāmatas Hardcover Book (Grāmata ar cieto muguriņu un vāku) |
| Izlaists | 2009. gada 17. novembris |
| ISBN13 | 9781441909831 |
| Izdevēji | Springer-Verlag New York Inc. |
| Lapas | 285 |
| Izmēri | 165 × 242 × 23 mm · 603 g |
| Valoda | Angļu |
| Redaktors | Cahill, Sean S. |
| Redaktors | Kim, Franklin |
| Redaktors | Kuang, Ken |
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