Antonis Papanikolaou
Three Dimensional System Integration: IC Stacking Process and Design Antonis Papanikolaou 2011 edition

Name: Three Dimensional System Integration: IC Stacking Process and Design
Price: 64.49 EUR
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Author: Antonis Papanikolaou

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Paperback Book

2011 edition

(2014) € 52,49

Three Dimensional System Integration: IC Stacking Process and Design

Antonis Papanikolaou

2011 edition

Three-dimensional (3D) integrated circuit (IC) stacking is the next big step in electronic system integration. This results in consumer electronics (e.g., mobile, handheld devices) which can run more powerful applications, such as full-length movies and 3D games, with longer battery life.

254 pages, biography

Mediji	Grāmatas Hardcover Book (Grāmata ar cieto muguriņu un vāku)
Izlaists	2010. gada 15. decembris
ISBN13	9781441909619
Izdevēji	Springer-Verlag New York Inc.
Žanrs	Aspects (Academic) > Science / Technology Aspects
Lapas	246
Izmēri	155 × 235 × 15 mm · 571 g
Valoda	Angļu
Redaktors	Papanikolaou, Antonis
Redaktors	Radojcic, Riko
Redaktors	Soudris, Dimitrios