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Thermal and Structural Electronic Packaging Analysis for Space and Extreme Environments - Resilience and Sustainability in Civil, Mechanical, Aerospace and Manufacturing Engineering Systems Juan Cepeda-Rizo
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Paredzamā piegāde . gada 3. - 17. nov.
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Thermal and Structural Electronic Packaging Analysis for Space and Extreme Environments - Resilience and Sustainability in Civil, Mechanical, Aerospace and Manufacturing Engineering Systems
Juan Cepeda-Rizo
This book provides useful and practical approaches to solving the most complex thermal-structural problems ever attempted for design spacecraft to survive the severe cold of deep space, as well as the unforgiving temperature swings on the surface of Mars.
290 pages, 70 Tables, black and white; 188 Line drawings, black and white; 29 Halftones, black and w
| Mediji | Grāmatas Paperback Book (Grāmata ar mīksto vāku un līmēto muguru) |
| Izlaists | 2024. gada 26. augusts |
| ISBN13 | 9781032160856 |
| Izdevēji | Taylor & Francis Ltd |
| Lapas | 290 |
| Izmēri | 157 × 233 × 21 mm · 470 g |
| Valoda | Angļu |
