Pastāsti draugiem par šo preci:
Thermal and Structural Electronic Packaging Analysis for Space and Extreme Environments - Resilience and Sustainability in Civil, Mechanical, Aerospace and Manufacturing Engineering Systems Juan Cepeda-Rizo 2. izdevums
Cena
€ 132,49
Paredzamā piegāde 2027. gada 4. - 6. janv.
Ziemassvētku dāvanas var atgriezt līdz 31. janvārim
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Pieejams arī kā:
Thermal and Structural Electronic Packaging Analysis for Space and Extreme Environments - Resilience and Sustainability in Civil, Mechanical, Aerospace and Manufacturing Engineering Systems
Juan Cepeda-Rizo
Suitable for practicing professionals as well as upper-level students in the areas of aerospace, mechanical, thermal, electrical, and systems engineering, Thermal and Structural Electronic Packaging Analysis for Space and Extreme Environments has cutting-edge information on how to design, analyze, and test in the small satellite environment.
| Mediji | Grāmatas Hardcover Book (Grāmata ar cieto muguriņu un vāku) |
| Tiks izlaists | 2026. gada 24. decembris |
| ISBN13 | 9781041216919 |
| Izdevēji | Taylor & Francis Ltd |
| Lapas | 304 |
| Izmēri | 150 × 220 × 20 mm · 490 g (Svars (aptuveni)) |
