Pastāsti draugiem par šo preci:
Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging: Volume I Materials Physics - Materials Mechanics. Volume II Physical Design - Reliability and Packaging Y C Lee 2007 edition
Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging: Volume I Materials Physics - Materials Mechanics. Volume II Physical Design - Reliability and Packaging
Y C Lee
This handbook provides the most comprehensive, up-to-date and easy-to-apply information on the physics, mechanics, reliability and packaging of micro- and opto-electronic materials.
1460 pages, biography
| Mediji | Grāmatas Hardcover Book (Grāmata ar cieto muguriņu un vāku) |
| Izlaists | 2006. gada 1. oktobris |
| Oriģinālā izdošanas datums | 2007 |
| ISBN13 | 9780387279749 |
| Izdevēji | Springer-Verlag New York Inc. |
| Lapas | 1460 |
| Izmēri | 178 × 254 × 73 mm · 3,22 kg |
| Valoda | Angļu |
| Redaktors | Lee, Y.C. |
| Redaktors | Suhir, Ephraim |
| Redaktors | Wong, C.P. |