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Bonding in Microsystem Technology - Springer Series in Advanced Microelectronics Jan A. Dziuban Softcover reprint of hardcover 1st ed. 2006 edition
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Bonding in Microsystem Technology - Springer Series in Advanced Microelectronics
Jan A. Dziuban
This is the first compendium on silicon/glass microsystems made by deep wet etching and the first book with a detailed description of bonding techniques used in microsystem technology. Technological results presented in the book have been tested experimentally by the author and his team, and can be utilized in day-to-day laboratory practice.
334 pages, biography
| Mediji | Grāmatas Paperback Book (Grāmata ar mīksto vāku un līmēto muguru) |
| Izlaists | 2010. gada 25. novembris |
| ISBN13 | 9789048171514 |
| Izdevēji | Springer |
| Lapas | 334 |
| Izmēri | 155 × 235 × 18 mm · 494 g |
| Valoda | Angļu |
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