On-chip Thermal Monitoring: Design, Placement and Interconnection of Temperature Sensors - Marisa Lopez-vallejo - Grāmatas - LAP LAMBERT Academic Publishing - 9783659511264 - 2014. gada 3. janvāris
Ja vāks un nosaukums nesakrīt, pareizs ir nosaukums

On-chip Thermal Monitoring: Design, Placement and Interconnection of Temperature Sensors

Cena
€ 64,99

Pasūtīts no attālās noliktavas

Paredzamā piegāde . gada 17. - 25. nov.
Ziemassvētku dāvanas var atgriezt līdz 31. janvārim
Saņemiet paziņojumus par jauniem Marisa Lopez-vallejo izdevumiem
Pievienot savam iMusic vēlmju sarakstam

Not rated yet

Temperature is a first class design concern in modern integrated circuits. The important increase in power densities associated to recent technology evolutions has lead to the apparition of thermal gradients and hot spots during run time operation. Temperature impacts several circuit parameters such as speed, cooling budgets, reliability, power consumption, etc. In order to fight against these negative effects, dynamic thermal management techniques adapt the behavior of the chip relying on the information of a monitoring system that provides run-time thermal information of the die surface. This book covers the most important topics related to on-chip thermal monitoring, such as the design, placement and interconnection of temperature sensors, from a practical perspective.

Mediji Grāmatas     Paperback Book   (Grāmata ar mīksto vāku un līmēto muguru)
Izlaists 2014. gada 3. janvāris
ISBN13 9783659511264
Izdevēji LAP LAMBERT Academic Publishing
Lapas 188
Izmēri 150 × 220 × 10 mm   ·   298 g
Valoda Vācu