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RF and Microwave Microelectronics Packaging II Softcover reprint of the original 1st ed. 2017 edition
RF and Microwave Microelectronics Packaging II
It is a companion volume to “RF and Microwave Microelectronics Packaging” (2010) and covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods, and other RF and microwave packaging topics.
172 pages, 130 Tables, color; 77 Illustrations, color; 50 Illustrations, black and white; XII, 172 p
| Mediji | Grāmatas Paperback Book (Grāmata ar mīksto vāku un līmēto muguru) |
| Izlaists | 2018. gada 9. jūnijs |
| ISBN13 | 9783319847191 |
| Izdevēji | Springer International Publishing AG |
| Lapas | 172 |
| Izmēri | 150 × 220 × 10 mm · 272 g |
| Valoda | Vācu |
| Redaktors | Kuang, Ken |
| Redaktors | Sturdivant, Rick |