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RF and Microwave Microelectronics Packaging II 1st ed. 2017 edition
RF and Microwave Microelectronics Packaging II
It is a companion volume to “RF and Microwave Microelectronics Packaging” (2010) and covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods, and other RF and microwave packaging topics.
172 pages, 50 black & white illustrations, 77 colour illustrations, 130 colour tables, biography
| Mediji | Grāmatas Hardcover Book (Grāmata ar cieto muguriņu un vāku) |
| Izlaists | 2017. gada 22. marts |
| ISBN13 | 9783319516967 |
| Izdevēji | Springer International Publishing AG |
| Lapas | 172 |
| Izmēri | 155 × 235 × 13 mm · 439 g |
| Valoda | Franču |
| Redaktors | Kuang, Ken |
| Redaktors | Sturdivant, Rick |