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Materials for Advanced Packaging Softcover reprint of the original 2nd ed. 2017 edition
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Materials for Advanced Packaging
Original chapters on bonding and joining techniques, nanopackaging and biomedical packaging, MEMS and wafer level chip scale packaging, and packaging materials such as lead-free solders, flip chip underfills, epoxy molding compounds, and conductive adhesives have all been updated with the latest developments in the field.
969 pages, 434 Tables, color; 85 Tables, black and white; 440 Illustrations, color; 260 Illustration
| Mediji | Grāmatas Paperback Book (Grāmata ar mīksto vāku un līmēto muguru) |
| Izlaists | 2018. gada 8. jūnijs |
| ISBN13 | 9783319832098 |
| Izdevēji | Springer International Publishing AG |
| Lapas | 969 |
| Izmēri | 234 × 157 × 55 mm · 1,49 kg |
| Valoda | Vācu |
| Redaktors | Lu, Daniel |
| Redaktors | Wong, C.P. |