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Materials for Advanced Packaging 2nd ed. 2017 edition
Materials for Advanced Packaging
Original chapters on bonding and joining techniques, nanopackaging and biomedical packaging, MEMS and wafer level chip scale packaging, and packaging materials such as lead-free solders, flip chip underfills, epoxy molding compounds, and conductive adhesives have all been updated with the latest developments in the field.
983 pages, 260 black & white illustrations, 440 colour illustrations, 85 black & white tables, 434 c
| Mediji | Grāmatas Hardcover Book (Grāmata ar cieto muguriņu un vāku) |
| Izlaists | 2016. gada 30. decembris |
| ISBN13 | 9783319450971 |
| Izdevēji | Springer International Publishing AG |
| Lapas | 969 |
| Izmēri | 155 × 235 × 51 mm · 1,55 kg |
| Valoda | Franču |
| Redaktors | Lu, Daniel |
| Redaktors | Wong, C.P. |