Materials for Advanced Packaging -  - Grāmatas - Springer International Publishing AG - 9783319450971 - 2016. gada 30. decembris
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Materials for Advanced Packaging 2nd ed. 2017 edition

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Original chapters on bonding and joining techniques, nanopackaging and biomedical packaging, MEMS and wafer level chip scale packaging, and packaging materials such as lead-free solders, flip chip underfills, epoxy molding compounds, and conductive adhesives have all been updated with the latest developments in the field.


983 pages, 260 black & white illustrations, 440 colour illustrations, 85 black & white tables, 434 c

Mediji Grāmatas     Hardcover Book   (Grāmata ar cieto muguriņu un vāku)
Izlaists 2016. gada 30. decembris
ISBN13 9783319450971
Izdevēji Springer International Publishing AG
Lapas 969
Izmēri 155 × 235 × 51 mm   ·   1,55 kg
Valoda Franču  
Redaktors Lu, Daniel
Redaktors Wong, C.P.

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