Three-Dimensional Integration of Semiconductors: Processing, Materials, and Applications -  - Grāmatas - Springer International Publishing AG - 9783319792552 - 2019. gada 28. marts
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Three-Dimensional Integration of Semiconductors: Processing, Materials, and Applications Softcover reprint of the original 1st ed. 2015 edition

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This book starts with background concerning three-dimensional integration - including their low energy consumption and high speed image processing - and then proceeds to how to construct them and which materials to use in particular situations.


408 pages, 35 Tables, black and white; 269 Illustrations, color; 191 Illustrations, black and white;

Mediji Grāmatas     Paperback Book   (Grāmata ar mīksto vāku un līmēto muguru)
Izlaists 2019. gada 28. marts
ISBN13 9783319792552
Izdevēji Springer International Publishing AG
Lapas 408
Izmēri 150 × 220 × 10 mm   ·   645 g
Valoda Vācu  
Redaktors Kada, Morihiro
Redaktors Kondo, Kazuo
Redaktors Takahashi, Kenji

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