Pastāsti draugiem par šo preci:
Three-Dimensional Integration of Semiconductors: Processing, Materials, and Applications Softcover reprint of the original 1st ed. 2015 edition
Three-Dimensional Integration of Semiconductors: Processing, Materials, and Applications
This book starts with background concerning three-dimensional integration - including their low energy consumption and high speed image processing - and then proceeds to how to construct them and which materials to use in particular situations.
408 pages, 35 Tables, black and white; 269 Illustrations, color; 191 Illustrations, black and white;
| Mediji | Grāmatas Paperback Book (Grāmata ar mīksto vāku un līmēto muguru) |
| Izlaists | 2019. gada 28. marts |
| ISBN13 | 9783319792552 |
| Izdevēji | Springer International Publishing AG |
| Lapas | 408 |
| Izmēri | 150 × 220 × 10 mm · 645 g |
| Valoda | Vācu |
| Redaktors | Kada, Morihiro |
| Redaktors | Kondo, Kazuo |
| Redaktors | Takahashi, Kenji |