Three-Dimensional Integration of Semiconductors: Processing, Materials, and Applications -  - Grāmatas - Springer International Publishing AG - 9783319186740 - 2015. gada 16. decembris
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Three-Dimensional Integration of Semiconductors: Processing, Materials, and Applications 1st ed. 2015 edition

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This book starts with background concerning three-dimensional integration - including their low energy consumption and high speed image processing - and then proceeds to how to construct them and which materials to use in particular situations.


408 pages, 191 black & white illustrations, 269 colour illustrations, 35 black & white tables, biogr

Mediji Grāmatas     Hardcover Book   (Grāmata ar cieto muguriņu un vāku)
Izlaists 2015. gada 16. decembris
ISBN13 9783319186740
Izdevēji Springer International Publishing AG
Lapas 408
Izmēri 155 × 235 × 24 mm   ·   775 g
Valoda Franču  
Redaktors Kada, Morihiro
Redaktors Kondo, Kazuo
Redaktors Takahashi, Kenji

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