Ran Wang
Testing of Interposer-Based 2.5D Integrated Circuits Ran Wang 1st ed. 2017 edition

Name: Testing of Interposer-Based 2.5D Integrated Circuits
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Author: Ran Wang

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Paperback Book

Softcover reprint of the original 1st ed. 2017 edition

(2018) € 110,49

Testing of Interposer-Based 2.5D Integrated Circuits

Ran Wang

1st ed. 2017 edition

The authors describe a set of design-for-test methods to address various challenges posed by the new generation of 2.5D ICs, including pre-bond testing of the silicon interposer, at-speed interconnect testing, built-in self-test architecture, extest scheduling, and a programmable method for low-power scan shift in SoC dies.

182 pages, 50 Tables, color; 102 Illustrations, color; 16 Illustrations, black and white; XIV, 182 p

Mediji	Grāmatas Hardcover Book (Grāmata ar cieto muguriņu un vāku)
Izlaists	2017. gada 29. marts
ISBN13	9783319547138
Izdevēji	Springer International Publishing AG
Lapas	182
Izmēri	150 × 220 × 20 mm · 453 g
Valoda	Vācu