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Arbitrary Modeling of TSVs for 3D Integrated Circuits - Analog Circuits and Signal Processing Khaled Salah Softcover reprint of the original 1st ed. 2015 edition
Arbitrary Modeling of TSVs for 3D Integrated Circuits - Analog Circuits and Signal Processing
Khaled Salah
This book presents a wide-band and technology independent, SPICE-compatible RLC model for through-silicon vias (TSVs) in 3D integrated circuits.
188 pages, 60 black & white illustrations, 99 colour illustrations, 58 black & white tables, 5 colou
| Mediji | Grāmatas Paperback Book (Grāmata ar mīksto vāku un līmēto muguru) |
| Izlaists | 2016. gada 23. augusts |
| ISBN13 | 9783319374970 |
| Izdevēji | Springer International Publishing AG |
| Lapas | 179 |
| Izmēri | 155 × 235 × 10 mm · 276 g |
| Valoda | Vācu |