Arbitrary Modeling of Tsvs for 3D Integrated Circuits - Analog Circuits and Signal Processing - Khaled Salah - Grāmatas - Springer International Publishing AG - 9783319076102 - 2014. gada 5. septembris
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Khaled Salah
Arbitrary Modeling of Tsvs for 3D Integrated Circuits - Analog Circuits and Signal Processing 2015 edition

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This book presents a wide-band and technology independent, SPICE-compatible RLC model for through-silicon vias (TSVs) in 3D integrated circuits. This model accounts for a variety of effects, including skin effect, depletion capacitance and nearby contact effects. Readers will benefit from in-depth coverage of concepts and technology such as 3D integration, Macro modeling, dimensional analysis and compact modeling, as well as closed form equations for the through silicon via parasitics. Concepts covered are demonstrated by using TSVs in applications such as a spiral inductor and inductive-based communication system and bandpass filtering.

271 pages, 60 black & white illustrations, 99 colour illustrations, 58 black & white tables, 5 colou

Mediji Grāmatas     Hardcover Book   (Grāmata ar cieto muguriņu un vāku)
Izlaists 2014. gada 5. septembris
ISBN13 9783319076102
Izdevēji Springer International Publishing AG
Lapas 271
Izmēri 155 × 235 × 13 mm   ·   449 g
Valoda Angļu  

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