Pastāsti draugiem par šo preci:
Three-dimensional Integration and Modeling: a Revolution in Rf and Wireless Packaging (Synthesis Lectures on Computational Electromagnetics) Jong-hoon Lee 1. izdevums
Mūsu klienti saka:
Three-dimensional Integration and Modeling: a Revolution in Rf and Wireless Packaging (Synthesis Lectures on Computational Electromagnetics)
Jong-hoon Lee
This book presents a step-by-step discussion of the 3D integration approach for the development of compact system-on-package (SOP) front-ends. Various examples of fully-integrated passive building blocks (cavity/microstip filters, duplexers, antennas), as well as a multilayer ceramic (LTCC) V-band transceiver front-end midule demonstrate the revolutionary effects of this approach in RF/Wireless packaging and multifunctional miniaturization. Designs covered are based on novel ideas and are presented for the first time for millimeterwave (60GHz) ultrabroadband wireless modules.
| Mediji | Grāmatas Paperback Book (Grāmata ar mīksto vāku un līmēto muguru) |
| Izlaists | 2007. gada 1. novembris |
| ISBN13 | 9781598292442 |
| Izdevēji | Morgan and Claypool Publishers |
| Lapas | 108 |
| Izmēri | 191 × 235 × 6 mm · 213 g |
| Valoda | Angļu |
Skatīt visus Jong-hoon Lee ( piem., Paperback Book )