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Three-Dimensional Integration and Modeling: A Revolution in RF and Wireless Packaging - Synthesis Lectures on Computational Electromagnetics Jong-Hoon Lee
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Three-Dimensional Integration and Modeling: A Revolution in RF and Wireless Packaging - Synthesis Lectures on Computational Electromagnetics
Jong-Hoon Lee
Table of Contents: Introduction / Background on Technologies for Millimeter-Wave Passive Front-Ends / Three-Dimensional Packaging in Multilayer Organic Substrates / Microstrip-Type Integrated Passives / Cavity-Type Integrated Passives / Three-Dimensional Antenna Architectures / Fully Integrated Three-Dimensional Passive Front-Ends / References
108 pages, X, 108 p.
| Mediji | Grāmatas Paperback Book (Grāmata ar mīksto vāku un līmēto muguru) |
| Izlaists | 2007. gada 31. decembris |
| ISBN13 | 9783031005756 |
| Izdevēji | Springer International Publishing AG |
| Lapas | 108 |
| Izmēri | 190 × 235 × 12 mm · 240 g |
| Valoda | Angļu |