Three-Dimensional Integration and Modeling: A Revolution in RF and Wireless Packaging - Synthesis Lectures on Computational Electromagnetics - Jong-Hoon Lee - Grāmatas - Springer International Publishing AG - 9783031005756 - 2007. gada 31. decembris
Ja vāks un nosaukums nesakrīt, pareizs ir nosaukums

Three-Dimensional Integration and Modeling: A Revolution in RF and Wireless Packaging - Synthesis Lectures on Computational Electromagnetics


Saņemt e-pastu, kad prece būs pieejama
Do you have a profile? Pierakstīties
Saņemiet paziņojumus par jauniem Jong-Hoon Lee izdevumiem
Pievienot savam iMusic vēlmju sarakstam

Not rated yet

Table of Contents: Introduction / Background on Technologies for Millimeter-Wave Passive Front-Ends / Three-Dimensional Packaging in Multilayer Organic Substrates / Microstrip-Type Integrated Passives / Cavity-Type Integrated Passives / Three-Dimensional Antenna Architectures / Fully Integrated Three-Dimensional Passive Front-Ends / References


108 pages, X, 108 p.

Mediji Grāmatas     Paperback Book   (Grāmata ar mīksto vāku un līmēto muguru)
Izlaists 2007. gada 31. decembris
ISBN13 9783031005756
Izdevēji Springer International Publishing AG
Lapas 108
Izmēri 190 × 235 × 12 mm   ·   240 g
Valoda Angļu  

Vairāk no tā paša izdevēja

Skatīt visus Jong-Hoon Lee ( piem., Paperback Book )