Pastāsti draugiem par šo preci:
Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging: Volume I Materials Physics - Materials Mechanics. Volume II Physical Design - Reliability and Packaging Softcover reprint of the original 1st ed. 2007 edition
Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging: Volume I Materials Physics - Materials Mechanics. Volume II Physical Design - Reliability and Packaging
This handbook provides the most comprehensive, up-to-date and easy-to-apply information on the physics, mechanics, reliability and packaging of micro- and opto-electronic materials.
1460 pages, LXII, 1460 p. In 2 volumes, not available separately.
| Mediji | Grāmatas Paperback Book (Grāmata ar mīksto vāku un līmēto muguru) |
| Izlaists | 2016. gada 23. augusts |
| ISBN13 | 9781489978851 |
| Izdevēji | Springer-Verlag New York Inc. |
| Lapas | 1460 |
| Izmēri | 150 × 220 × 10 mm · 2,82 kg |
| Valoda | Angļu |
| Redaktors | Lee, Y.C. |
| Redaktors | Suhir, Ephraim |
| Redaktors | Wong, C.P. |