Pastāsti draugiem par šo preci:
High-frequency Characterization of Electronic Packaging - Electronic Packaging and Interconnects Luc Martens Softcover Reprint of the Original 1st Ed. 1998 edition
High-frequency Characterization of Electronic Packaging - Electronic Packaging and Interconnects
Luc Martens
170 pages, biography
| Mediji | Grāmatas Paperback Book (Grāmata ar mīksto vāku un līmēto muguru) |
| Izlaists | 2014. gada 23. februāris |
| ISBN13 | 9781461375739 |
| Izdevēji | Springer-Verlag New York Inc. |
| Lapas | 170 |
| Izmēri | 155 × 235 × 10 mm · 258 g |
| Valoda | Angļu |