Pastāsti draugiem par šo preci:
The Simulation of Thermomechanically Induced Stress in Plastic Encapsulated Ic Packages Gerard Kelly Softcover Reprint of the Original 1st Ed. 1999 edition
The Simulation of Thermomechanically Induced Stress in Plastic Encapsulated Ic Packages
Gerard Kelly
153 pages, black & white illustrations, bibliography
| Mediji | Grāmatas Paperback Book (Grāmata ar mīksto vāku un līmēto muguru) |
| Izlaists | 2012. gada 8. oktobris |
| ISBN13 | 9781461372769 |
| Izdevēji | Springer-Verlag New York Inc. |
| Lapas | 134 |
| Izmēri | 155 × 235 × 9 mm · 235 g |
| Valoda | Angļu |